| Final production version: Revision notes | |
| updated: | 10/30/2002 [yellow highlighted items: change from 9/23 to 10/30 version] |
| QNET2 board: | |
| BP42,BP43 | 2x 0.1uF added as bypass caps for VCCint (2.5V) near U3 |
| C19,C21 | changed to 150uF cap. |
| C20b | 150uF added next to C20 (-5V) |
| C22 | 0.1uF added as part of U1/pin2 (VCC) low pass filter |
| C23 | 20pF added at instrument amp input (U18/pin2+3) |
| C24 | 1uF added between "barometer" signal and GND for low pass filter |
| C25 | 10uF added as part of U1/pin2 (VCC) low pass filter |
| D12 | removed due to temp sensor change (SCL signal obsolete) |
| J2 | pin 4 connected to VCC |
| J6,J7 | holes widened to 110mil |
| JP1 | pin 9 changed from SCL to V+ (new temp sensor needs only one signal line) |
| JP8 | 4x2-pin header added for optional GPS serial port monitoring/testing |
| L1 | inductor added as part of U1/pin2 (VCC) low pass filter |
| R37 | changed to 1K pot |
| R38 | changed to 1.8K (1%) |
| R40,R46 | silk print labels were reversed in prototype … |
| R40,R47 | replace with 0 Ohms or close bridge |
| R42,R46 | leave open (unstuffed) or remove |
| R54 | changed to 10K and used as pull-up for temp sensor signal (SDA) |
| R59 | 1K pull-down added to U3/pin1 (TClk) |
| R60 | 1K pull-up added to U3/pin34 (TMS) |
| R61 | 1K pull-up added to U3/pin105 (TDI) |
| R62 | 120R added in "barometer" signal for low pass filter |
| U1 | changed multiplier decoding from x4 to x3.33: S1=n/c (pin 7), S0=VCC (pin 6): CLK=41.666MHz |
| U13 | added thermal heatsink pad; see http://www-s.ti.com/sc/psheets/slma002/slma002.pdf |
| U16 | pin 1 (BOOST) connected to V+ to increase frequency |
| U2 | pin 11 (ZSG): tied to VCC, not GND |
| U2 | pin 55 (Div4): left open with jumper option for GND or VCC |
| U2 | pin 71 (TstrOSC): left open with jumper option for GND or VCC |
| U2 | pin 135 (ClkP): connect to jumper to select 12.5MHz (U1/pin4) or 41.66MHz (U1/pin5) |
| U4 | pins 20/21 (P2.0/P2.1): removed SDA/SCL lines due to change of temp sensor type |
| U4 | pin 22 (P2.2): connected new temp sensor (TMP03) signal here; "TmpS" |
| U4 | pin 19 (P1.7): added test point TPDBG here for MSP430 code debugging |
| U8 | changed to SOIC "wide" (~330 mil) |
| silk print | some Refdes./Partdes. labels were too small to be legible; changed min text size to 40mil x 6mil |
| LVDS_TS board: | |
| JP1 | layout changed to 2-sided SMD type (5 pins top, 5 pins bottom layer) to save space |
| JP1 | pin 9: change to V+ |
| R3 | 1.2K resistor added between JP1 / pin 3 and P1 / pin 2 [GPS-TX signal] |
| R4 | optional resistor in series of temp sensor output (TMP03: 0 Ohms; TMP04: 1K) |
| U1 | changed to TMP03 or TMP04 (alternate temp sensor) |
| U1 | adjusted thru-pad sizes and spaces to actual TO-92 specs of part# TMP03FT9 |
| size | board size changed to 0.7"x0.575" |